Low Profile BGA packages.

I added a new page to cover a Low-Profile Ball Grid Array or LBGA. For some of these pages I provide package dimensions, but I didn't bother this time. I'm not even sure if the exact height of an LBGA is set or if it's more of an industry standard.

A related page covers a normal Ball Grid Array. Right now the page is a changed copy of the BGA page so I still may need to make some changes. But the important thing is that I got the new page added tonight before I got side track with fixing some other page. The new page is linked off the page that covers Surface Mount IC Packages.

Although BGA style packages are not used for processors in PCs they are used for a number of other components within a PC. Pin Grid Arrays are used for PC processors, while BGA style devices are used for memory and chip sets.

However BGA devices are used to great extend in industry, not because they always have more pins than a PGA but because BGAs are surface mount devices. Normally it's preferred to have all surface mount devices or all through hole devices during board construction.